Dynamic Motion Technology – Part 2
Dynamic Motion Technology Paybacks
#2: Reduce Machine Cycles
With Dynamic Motion technology, improved material removal rates go hand in hand with reduced cutting tool wear. With shallower stepovers but deeper stepdowns, today’s advanced cutting tools will last longer, as they continually bite into enough material to carry the heat away from the cutting tool and the material.
Based on what your machine can handle (and this is very easy to determine), you can progressively decrease stepovers and increase speeds until you arrive at the “sweet spot” where you have the best balance of material removal volume and tool life. Both will almost always be better than results on conventional aggressive hogging out strategies that rely on >50% stepovers and shallow depths of cut.
What Dynamic Users Are Reporting
Ash Industries (Lafayette, LA): With the advances Mastercam has made in the last three or four iterations, our productivity in the shop has skyrocketed. I am programming faster. I have templates set up for electrodes for my molds. I just drag and drop my geometry from SOLIDWORKS into Mastercam — I’m picking lines, picking surfaces, right from my default file and programming faster than I ever thought possible. Electrodes that used to take me a half hour or so, I am now programming in minutes. We are cutting some mold plates up to 70% faster with Dynamic Toolpaths. Over the last three versions of Mastercam, our productivity has improved exponentially. (Eddie Higginbotham, CNC Manufacturing Supervisor)
Almost Instantaneous: At Ash Industries, programming toolpaths to cut the geometry indicated in the CNC program has become almost instantaneous. The programmer relies on just a small number of very efficient, material-aware dynamic toolpaths that will handle just about any cutting requirement. These include OptiRough, OptiCore, and Hybrid Finishing, a technique that switches cutting methods based on the shape of the part and automatically blends transitions between steep and shallow areas.